Pokemon Black And White 2 Official Strategy Guide Pdf
Download pokemon black version 2 pokemon white version 2 strategy guide for free in pdf format. Click Download button to download the pokemon black version 2 pokemon white version 2 strategy guide in pdf format.1. Field of the Invention
This invention pertains to the field of semiconductor device fabrication. More particularly, the invention pertains to chemical-mechanical polishing of metal layers.
2. Description of the Related Art
Fabrication of integrated circuits involves placing thousands of devices on a single semiconducting substrate. For example, hundreds of semiconductor dice are fabricated on a single semiconductor wafer. Following the fabrication of the dice, the wafer is sawed into individual dice. Although the fabrication process for each individual die is complex, the process for fabricating the entire wafer is highly automated. The process of fabricating dice includes the deposition of various materials, patterning the materials, doping regions of various dopants, and other various steps. An important portion of the process involves formation of metal layers on the semiconductor substrate.
Accurate reproduction of the circuit patterns on the wafer is necessary for the fabrication of reliable semiconductor devices. In the most accurate methods of pattern reproduction, a mask of the desired pattern is used to direct a radiation beam onto the surface of the wafer. Following exposure, the mask is removed and the wafer is chemically and mechanically polished to remove the radiation-sensitive material and impart a planar surface to the substrate. This planarization process, referred to as chemical-mechanical polishing (CMP), plays a critical role in the fabrication of high-performance devices.
Conventionally, CMP is performed using a polishing machine incorporating a rotating polishing pad attached to a carrier. The carrier may be held by a top driver or by a bottom driver. In either case, the polishing pad is rotated by a motor. A slurry dispensed on the surface of the polishing pad may contain a chemical compound such as diamond particles or colloidal silica.
During the polishing process, the rotating polishing pad and the rotating carrier apply a downward force on the surface of the semiconductor wafer. The downward force and the chemical compound in the slurry aid in the removal of the surface of the wafer. The rate of polishing is defined by the downward force exerted on the wafer and the rotational speed of the polishing pad. In general, the planarization of the wafer is measured using an optical system. The
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